The same die grid rendered four ways depending on how much geometry is supplied to buildWaferMap.
A — no geometry, normalized units. B — die size only, diameter inferred.
C — diameter only, pitch estimated, notch visible. D — fully specified with a 5 mm edge exclusion band (dimmed dies are excluded from yield).
A — grid positions only
Neither provided.
Pitch inferred by nearest-neighbour step analysis.
units: 'normalized' — proportionally correct but not in mm.
B — die size provided
dieConfig: { width: 8, height: 12 } — diameter inferred from
grid extent × pitch. units: 'mm'
C — diameter provided
waferConfig: { diameter: 300 } — die pitch estimated from
diameter ÷ grid extent. Notch visible. units: 'mm'
D — fully specified + edge exclusion
diameter: 300, notch: bottom, edgeExclusion: 5 mm, die: 8×12 mm.
Dimmed dies fall within the 5 mm exclusion band and are excluded from yield.